Mr. Andrew Timmerman is President - Fairfield Crystal Technology, responsible for Fairfield’s Business Management and Operations. In his previous appointment he was instrumental in commercializing silicon carbide (SiC) wafers helping establish Sterling Semiconductor as the 2nd world supplier of SiC wafers. He directed the operations efforts for both a $5.9-million DARPA and a $3.2-million Title-III contract focused on establishing Merchant Suppliers for silicon carbide wafers. Mr. Timmerman has more than 23 years of management, manufacturing and engineering experience. Prior to starting Fairfield Crystal Technology, LLC, he held various management positions for Dow Corning, Uniroyal Technology/Sterling Semiconductor and Silicon Valley Group. He graduated from Lehigh University with a Bachelor Degree in Mechanical Engineering, earned an MBA from Fairleigh Dickinson University and a Master Degree in Manufacturing Engineering from Polytechnic University.